The XPG V3 DDR3 3100 – A 3100MHz RAM for overclockers with transfer bandwidth reaching 24.8GB/s,supports Extreme Memory Profile (XMP) version 1.3 and utilizes the Thermal Conductive Technology (TCT) which reduces the system temperature effectively.
Every chip is in direct contact with the heatsink, ensuring IC and PCB operate in an environment of equal temperature for the best stability even in full-speed operation.
The detachable fins on the XPG V3 DDR3 3100 extends upwards and it has 8-layer PCBs with 2oz copper, providing superior cooling performance and stable data transfer. The 2oz copper can greatly decrease electric resistance and consumes less power for higher efficiency. It also helps to improve the integrity of signal transfer by the lower EMI (ElectroMagnetic Interference), enabling overclockers to get excellent benchmarks in the circumstance of great stability and stable signal.
The detachable fin heatsinks can be replaced and fastened by screws, making the XPGâ„¢ V3 series more durable for long-term use. In addition, there’s one more pair of fins included in the package for the 1st lot of shipment, allowing users to exchange the fins and create the coolest rig! For safety and excellent service, all XPG gaming modules are RoHS compliant and come with a lifetime warranty.
– Speeds up to 3100 megahertz
– Transfer bandwidth reachine 24,800 MB/s
– Supports dual channel mode
– High-quality 8-layer PCB with 2oz copper for improved cooling performance and higher efficiency
– Detachable fins
– Supports the latest Intel Z97 platform